High values of TP copper plating liquid is a kind of high efficiency, high penetration of acid copper luster agent, has a uniform coating deposition and good ductility, it can make the wall of hole and surface coating thickness ratio reached 1.8 in conjunction with the equipment: more than 1, and in high voltage and low voltage can increase the ductility of coating, glossiness, and precision plating deposition of fine lines. In addition, the maintenance of working fluid is simple, just a kind of additive and will not form harmful decomposition, to avoid the frequent activated carbon processing.