VCP process Back
Introduction:
After a black hole or hole metallization plate after VCP pretreatment adjustment and to oxidation in the copper plating tank through the appropriate current customer needs thickness in hole and surface electroplating copper layer.
Solutions:
1. Easy operation, full automatic operation, reduce man-made bad and human cost;
2. Electroplating uniformity, good ability to plated through hole, cooperate with blind hole, hole filling plating potions features can do;
3. The plating efficiency and stability;
4. All artifacts are continuous from one side to another one side the electroplating, every piece of artifacts of exactly the same production conditions;