ENIG is through the chemical reaction on the surface of copper replacement palladium on palladium nuclear chemical plating on the basis of a layer of nickel phosphorus alloy layer, and then through the substitution reaction on the surface of nickel plating a layer of gold, the production process without current conduction, gold nickel thickness,

Due to chemical nickel gold plate nickel gold layer of good dispersion, good welding and welding performance, good lineup (Bonding, TS Bond or U Bond) performance, can be compatible with all kinds of flux, but it is also an excellent copper surface protective layer.

Is used on the soft board potion that shangcun, has a good bending and weldability, good Bonding properties, nickel and gold layer harmful material conform to the requirements of ROHS, automatic production line and efficient, more stable gold nickel thickness.