Desmear: production plate after drilling of high speed rotating very porous fouling on the inner wall of the hole, if you don't remove will affect subsequent copper plating and the adhesion strength of the base material in holes, and also leads to the inner layer copper and copper plating hole separation, in addition to plastic wall of bore with potassium permanganate to remove dirt and profanity, improve hole copper plating and the adhesion strength of the base material

PTH: there will be no conductive pore wall adopts the method of chemistry sink copper a thin layer of copper on the hole wall sink, for subsequent VCP plated copper metallization conductive to prepare.

Solution:

Automatic vertical degumming and vertical PTH automatic production line for degumming and PTH provides good quality and capacity.

Vertical continuous plating the copper plating thickness more uniform, continuous production, easy to control, more reliable quality.